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2012-01-31
Press Release; "Tanaka Precious Metals Establishes Production Subsidiary in Taiwan to Begin Manufacturing of Copper Bonding Wire on February 1"(PDF:88KB)
2012-01-27
Articles about "Asia Electronics Industry" February 2012 (English)(PDF:1687KB)
2012-01-19
Press Release; "Tanaka Precious Metals Develops World’s First Ruthenium Material Able to Form a Film Up to Six Times the Normal Depth for DRAM Capacitor Electrodes"(PDF:345KB)
2012-01-18
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2012-01-17
Press Release; " Tanaka Precious Metals Begins Providing World’s First Silver Ink Able to Form Electronic Circuits with UV Light"
2012-01-12
Press Release; "Tanaka Precious Metals Begins Sale of Three High-Functional Bonding Wire Products"
2011-12-26
Press Release; "Tanaka Precious Metals Exclusively Supply Ruthenium Dye for Dye-Sensitized Solar Cells"
2011-12-26
Articles about "Asia Electronics Industry" January 2012 (English)(PDF:766KB)
2011-12-15
Press Release; "Tanaka Precious Metals Starts Operation of Sodegaura Plant on January 5 Next Year"
2011-12-08
Notice of Server Maintenance
2011-11-30
Press Release; "Tanaka Precious Metals begins full-scale operation of Malaysian local subsidiary on December 1"
2011-11-25
Articles about "Asia Electronics Industry" December 2011 (Chinese)(PDF:1703KB)
2011-11-08
Press Release; Palladium Alloy Plating Solution is Able to Mass-Produce Electrical Contacts as a Substitute for Gold
2011-11-01
Articles about "Asia Electronics Industry" November 2011 (English)(PDF:618KB)
2011-09-13
Press Release; "Tanaka Precious Metals Expands Lineup of Electron Beam Welding Materials"
2011-08-31
Press Release; "Applications for the Subjects of “Precious Metals Research Grants” Open on September 1"
2011-08-30
Articles about "Asia Electronics Industry" September 2011 (English)(PDF:828KB)
2011-08-04
Press Release; "Tanaka Precious Metals First to Obtain ISO/IEC17025 Accreditation for Platinum and Palladium Analysis Technology in Japan"
2011-07-25
Articles about "Asia Electronics Industry" August 2011 (Chinese)(PDF:1832KB)
2011-07-12
Press Release; "Tanaka Precious Metals and SUSS MicroTec to Jointly Develop Sub-micron Gold Particle Pattern Transfer and Bonding Technology"
2011-07-11
Press Release; "Tanaka Precious Metals to Start Producing Copper Bonding Wire in 3 Locations Supply Network Risk Diversification and Doubling Production Capacity"
2011-06-28
Press Release; "Tanaka Precious Metals Announces Shipment Volume (Index) of Fuel Cell Catalyst for FY2010, Record Shipment Volume of Fuel Cell Catalysts"(PDF:126KB)
2011-06-13
Press Release; "Tanaka Precious Metals to Begin Sale of Silver Bonding Wire"
2011-05-31
Press Release; "Tanaka Precious Metals Announces Recipients of "Precious Metals Research Grants""(PDF:174KB)
2011-05-25
Articles about "Asia Electronics Industry" June 2011(PDF:744KB)
2011-05-10
Press Release; "Tanaka Precious Metals Recognized as Elite Supplier of Fuel Cell Catalysts by Ballard Power Systems"(PDF:132KB)
2011-04-18
Articles about "Asia Electronics Industry" April 2011(PDF:448KB)
2011-02-28
Articles about "Asia Electronics Industry" February 2011 (Chinese)(PDF:1270KB)
2011-01-19
Press Release; "Tanaka Kikinzoku Kogyo to Begin Joint Development of Silver Analysis Technology Aiming at Establishing Global Standard with Japan Mint."(PDF:73KB)
2010-11-30
Press Release; "Tanaka Precious Metals Announces Shipment Volume (Index) of Fuel Cell Catalyst between FY2004 and the First Half of FY2010."(PDF:107KB)
2010-11-24
Press Release; "TOKYO ELECTRON and TANAKA KIKINZOKU KOGYO succeeded the Joint Development of Innovative Recycling Process of Ruthenium Precursors."(PDF:92KB)
2010-11-12
Press Release (for China); "Tanaka Precious Metals to Begin Providing Japan's First Large Silver Cylindrical Sputtering Target with a Three Times the Efficiency of Existing Items."
2010-09-15
Press Release (for Korea); "First in the world, Tanaka Precious Metals, EEJA, establishes new electroplating solution for Palladium Bumping in substitution for Gold Bumpong in LCD-driver IC."
2010-09-07
Press Release (for China); "First in the world, Tanaka Precious Metals, EEJA, establishes new electroplating solution for Palladium Bumping in substitution for Gold Bumpong in LCD-driver IC."
2010-09-03
Press Release; "Tanaka Precious Metals succeeds in development of high-sensitivity in-vitro diagnostic kit"(PDF:193KB)
2010-08-30
Press Release; "Tanaka Precious Metals Announces Shipping Volume of Bonding Wire between January 2008 and June 2010"
2010-08-24
Press Release; "Tanaka Precious Metals First to Obtain ISO/IEC 17025 Accreditation for Gold Analysis Technology in Japan"(PDF:204KB)
2010-07-14
Press Release; "Tanaka Precious Metals establishes ultrathin membrane processing technology for palladium-based hydrogen separation (permeation) membranes"(PDF:236KB)
2010-07-13
Press Release; "Tanaka Precious Metals Opens its Branch Office in San Jose, USA"(PDF:62KB)
2010-04-05
Press Release; "Easy to use Pork Detection Kits" for the Detection of Pork in Food"(PDF:878KB)

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