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• D-1 Printed Wiring Boards

D-1 Printed Wiring Boards

Custom Boards with value-added functions to suit each application

Electronic devices continue to gain in performance, speed, and density. Our integrated production system handles everything from pattern design to manufacturing, allowing us to offer custom boards with special functions added to suit individual applications.

Solutions to increase speed/frequency

• For users who wish to control characteristic impedance (Z0) with constraints in the number of layers and specifications:
  We propose layer-to-layer differential Z0 control as well as other types of control in various configurations. (1)
• For users who wish to evaluate waveform quality and transmission characteristics:
  We conduct evaluations using a complete set of evaluation equipment. (2)
• For circuit designers who wish to improve the quality of via waveforms:
  We propose improving signal reflection through via Z0 control and the elimination of unwanted substances. (3), (4)

Solutions for high density

• For users who wish to implement high-density, high functional components or to reduce component size:
  We provide high-density, fine-pitch wiring boards which use a buildup structure or fine hole-drilling technology.

Fine-pitch CSP mounted board (0.4mm pitch)

Solutions for large currents and heat radiation

• For users who wish to mount components supporting large currents and high heat generating components, such as wiring boards for electric vehicles:
  We propose various types of heat radiation structures which support large currents and are suitable for individualized applications.

Flex-rigid (F/R) solutions

• For users who wish to eliminate the connector joints problems between wiring boards:
  We have developed two to eight flexible layers (supporting Z0 control).
• These layers eliminate connection failures, connector contact resistance, spatial implementation restrictions, the need to secure connector space and problems with the number of man-hours required for mounting connectors.

Others

• Wiring boards which support high frequencies that corresponds to various low dielectric materials
• High-thickness, high-multilayer wiring boards for semiconductor testers
• Fine-pitch, large-sized evaluation boards for burn-in tests
• Composite structures which combine general-purpose FR-4 and low dielectric material
• Countersink boards which allow for size reduction and improvements in heat radiation
• Wiring boards which support halogen-free/Pb-free implementations
• Quality control systems that enabled our plants to be certified by the Ministry of Defense and JAXA