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B-8 Bonding Wires

We are the world's largest provider of bonding wires, delivering optimum quality wires suitable for ICs and LSIs.

Bonding wires are used for a wide range of products, such as ICs, LSIs and transistors. We bring you sound products at the cutting-edge of semiconductor technology.

• Gold Bonding Wire
• Gold Alloy Bonding Wire
• Hand Free Case
• Copper Bonding Wire
• Aluminum Bonding Wire for Power Devices
• Aluminum Bonding Ribbon
• Aluminum-Silicon Bonding Wire

Gold Bonding Wire

Features

• Available with various types of package design such as DIP, SIP, QFP, BGA and FBGA.
• Available with the latest type of package such as stacked package and super thin package.
• Use of higher tensile strength wires enables cost reductions with finer diameters.
• Use of higher tensile strength wires enables use with fine pitch package.

Gold Bonding Wire Characteristics and Applications by Type (Wire Size = 25 , Ball Diameter = Wire Size 2.5)

Type		Breaking load (mN)		Elongation (%)		HAZ length	Application	Feature
		Spec	Ave	Spec	Ave
High loop	Y	64-103	86	2.0-6.0	3.5	350-400	LED, TO, DIP, SIP
	GHA2	88-127	115	2.0-7.0	4.0	250-290	DIP, SIP, PLCC, QFP
Middle loop	GSA	69-144	106	1.0-7.0	4.0	170-190	QFN, QFP, DIP,SIP.CSP	Stable 2nd-bonding, fine pitch bonding
	GSB	79-155	118	1.0-7.0	4.0	140-160	QFN, QFP, BGA, DIP, SIP. CSP
	M3	88-132	119	2.0-7.0	4.0	220-260	DIP, SIP, QFP
	FA	88-132	107	2.0-7.0	4.0	180-200	DIP, SIP, QFP, BGA CSP
	GMH	102-154	128	2.0-7.0	5.0	160-190	DIP, SIP, QFP, BGA S-CSP	Highly resistant to vibration, good for fine pitch pads Good for long & short loops
	GMG	97-173	135	2.0-7.0	4.0	150-170		Good for fine pitch small pads Good for long & short loops
	GFC	76-152	114	2.0-7.0	4.0	150-170		High strength with less wire sweep, good for fine pitch small pads
	GFD	90-166	127	2.0-7.0	4.0	150-170
	GFB	108-181	123	2.0-10.0	5.0	140-160		High strength with less wire sweep, good for fine pitch pads
	GMH2	118-186	151	2.0-7.0	4.5	120-140
Low loop	GLD	98-137	111	2.0-7.0	5.0	130-140	DIP, SIP, QFP, BGA S-CSP
	GLF	98-157	130	2.0-7.0	5.0	110-130		Less neck damage, good for fine pitch pads Good for super low loops
Au alloy wire	GPG	102-154	128	2.0-6.0	4.0	130-160	DIP, SIP, QFP, BGA S-CSP	High reliability with 99.99% Au wires, good for fine pitch pads
	GPG-2	95-171	133	2.0-7.0	4.5	130-160

Short Loop Application

Long Loop Application

Multi-wire bonding

Gold Alloy Bonding Wire

Features

• Smaller squashed ball area
• Superior bonding reliability
• Can be used on conventional ball bonders

Aged at 200°C for 1000 hours

Hand Free Case

Features

• Makes it possible to attach and remove a bonding wire spool to the bonder machine without touching the spool
• Reduces mishandling

Detaching the spool from the case

Attaching the spool into the wire bonder

Au wire

Copper Bonding Wire

TCA1, TCB1, TPCW and TOCW Types

Features

• Enables a reduction in costs with a lower material cost than gold bonding wires
• Stable 1st-bonding (TOCW and TCA1 types)
• Stable 2nd-bonding (TCB1 and TCA1 types)
• Higher electrical conductivity (TPCW and TCB1 types)
• Precious metal coated wire CLR-1A type

Size

20 to 70

Comparison of Properties of Gold and Copper

Copper has excellent properties as a conductor.

Physical Properties	Au	Cu
Resistivity:[ cm]	2.3	1.7
Thermal conductivity:[W/m K]	320	398
Young's modulus:[GPa]	80	135

Cross-sectional Structure of the First Bonding Portion after a High Temperature Storage Test

• Voids due to Al intermetallic diffusion are unlikely to form.

*HTS conditions: Temp. 473K , Molded HF resin

Aluminum Bonding Wire for Power Devices

TANW and TPBW Types

Features

• Excellent corrosion resistance (TANW type)
• Excellent bondability
• Hard, Soft-1, and Soft-2 are available according to applications

Size

100 to 600

Aluminum wire

Aluminum Bonding Ribbon

TABR Types

Features

• Excellent corrosion resistance (equivalent to TANW wire)
• Available with multi-sizes

Size

• Width 0.5 to 2.5 mm, Thickness 0.05 to 0.3 mm

Aluminum ribbon

*The winding length differs depending on the ribbon size.

Aluminum-Silicon Bonding Wire

TABW and TABN Types

Features

• Uniform Si distribution
• Stable mechanical properties
• Stable quality wire without any curl, dirt and surface flaws
• Excellent bondability
• Excellent corrosion resistance (TABN type)

Size

18 to 80

Aluminum-silicon wire