- home
- Products
- A Precious Metal Film Formation Methods
- A-5 Plating Equipment
A-5 Plating Equipment
We offer high-performance plating equipment that supports cutting-edge plating technology.
We offer various types of wafer plating equipment in accordance with a customer's needs, from mass-production systems to prototyping or low-volume production. Our comprehensive plating system focuses on compatibility with chemical processes and, with its high performance, is capable of coping with advancing technology such as wafers of increasing diameters and decreasing chip sizes.
Plating System for Wafer Bump Plating
Fully-automated system for mass production POSFER C Series
Features
- Designed for easy production scale-up
- Process control functions for high quality plating deposits
- High operability with selectable automatic and manual modes
- Wafer Size:100-200 mm
POSFER C12
Semi-automated system for prototyping or low-volume production CUP-PLATER
Features
- Systems available for prototyping to production on a mass scale
- Semi-automatic type with high practicality and maintainability
- Wafer Size:100-200 mm
CUP-PLATER
Plating System for 300 mm Wafer Processing
Mass-production type fully automated system for automated lines POSFER 300
Features
- Capable of being installed in 300 mm wafer automated lines
- High speed production line for large diameter wafers
- Increased productivity and reduced footprint from our original size
- SEMI, CE marking certified
POSFER 300
Plating System for Wafer Level CSP
POSFER M
Features
- Sequential multi-chemical plating system
- Designed for per unit production scale-up
- Wafer Size:100-200 mm
POSFER M
