Precious Metal Film Formation Methods

Thick Film Pastes and Precious Metal Powders

We support further integration of electronic components and offer reliable quality.

Precious metal pastes, powders, and conductive adhesives are widely used in various applications, such as circuitry and semiconductor die bonding.
With our fine-tuned technology, we offer the best quality products for precision circuits.

Pastes for Electronic Parts and Circuitry

Features

  • Integrated manufacturing, beginning with powdered materials, has enabled cost reduction
  • Pastes are available to fit various applications
  • Various lead-free pastes are available
Applications and paste types
Applications Conductor materials Resistor materials Dielectric materials
Hybrid IC
• Alumina substrates
• Aluminum nitride substrates, etc
• LED, etc.
Ag-Pd paste
Ag-Pt paste
Ag paste
Cu paste
Au paste
RuO2 resistor paste
Ag-Pd resistor paste
Glass paste for:
Cross-over
Multilayer printing
N2 firing
Overcoat
Resistor Ag paste
Ag-Pd paste
RuO2 resistor paste
Ag-Pd resistor paste
Glass paste for overcoat
Sensor Pt paste
Au paste
Pt-Pd alloy paste
RuO2 resistor paste
Glass paste for overcoat
Laminated ceramic
Device
LTCC
Ag paste
Ag-Pt paste
Ag-Pd paste
Au paste
RuO2 resistor paste
Ag-Pd resistor paste
Glass paste for overcoat
Tantalum capacitor Ag paste for coating
C paste
Ag adhesive
- -
Thermal printer head Au paste
Au/MOD paste
Ag paste
RuO2 resistor paste Glass paste for overcoat
Heater Ag-Pd paste Ag-Pd resistor paste Glass paste for overcoat

* MOD: Organometallic

Conductive Adhesive for Die-bonding

Features

  • Support of power devices through high thermal heat conductivity
  • High reliability with low elasticity
High Thermal Conductivity Silver Adhesive Paste
Items Volume resistivity(µΩ·cm) Thermal conductivity(Wm-1K-1)
No. TS-333 Series 25 23
TS-185 Series 60 96
Low Elasticity Silver Adhesive Paste
No. Volume resistivity(µΩ·cm) Elastic modulus (MPa)
TS-170 Series 500 100

Precious Metal Powders for Pastes

Features

  • Precise film formation is possible during sintering
  • Capable of coping with highly diversified substrates and increasingly thin electrodes
  • Various precious metal powders are available
Main Types and Features of Powders
Product name Tap Density(g/cc) Mean Particle Size* (µm) Specific Surface Area(m2/g)
Platinum powder AY-1010 3.0~7.0 1.0~10.0 0.5~3.0
AY-1020 0.6~1.0 3.0~13.0 20.0~40.0
AY-1050 9.0~12.0 0.4~0.8 0.8~1.2
Silver powder AY-6010 0.7~1.6 6.0~13.0 1.0~2.5
AY-6080 3.5~4.5 0.2~1.0 1.5~3.0
Palladium powder AY-4030 0.6~1.2 1.0~7.0 9.0~16.0
AY-4054 4.0~7.0 0.3~1.4 0.4~1.7
AY-406 4.0~8.0 1.0~3.0 0.5~1.5
Gold powder AY-5022 2.0~12.0 0.3~2.0 0.2~1.0
Alloy powder Ag-Pd Various precious Metal alloy powders are also available.
Pt-Rh
Pt-Pd
Others

* Indicates 50% of the particle size measured by a particle size distribution analyzer.