Precious Metal Film Formation Methods

Plating Processes

We offer low-cost plating processes that meet the stringent requirements of a variety of applications.

We offer various plating processes, including those using precious metal plating solutions, for various applications from semiconductor components to decorative articles. We offer low-cost and highly productive plating processes with plating characteristics appropriate for their intended use.

Gold electroplating

TEMPEREX series

The superior bondability, heat resistance, and solderability of this series make them ideal for semiconductor components. Excellent thickness uniformity at a low gold concentration, enabling reduced Au consumption.

GALVANOMEISTER GB series

Gold electroplating process for wafer bumps. This series has excellent thickness uniformity, enabling plating with a high current density and low operation temperatures.

MICROFAB Au series

Non-cyanide Au plating for wafers. This series provides excellent properties for bump and fine pattern formation.

Process name Application Features
TEMPEREX 8400 Bonding pad areas Good uniform electrodeposition, neutral cyanide
TEMPEREX MLA300 Low gold concentration, Ni elution prevention, neutral cyanide
GALVANOMEISTER GB3 Wafers (bump) Low operation temperature, neutral cyanide
MICROFAB Au310 Wafers (wiring) Very fine surface roughness, neutral non-cyanide
MICROFAB AuFL2100 Low gold concentration、neutral non-cyanide
MICROFAB Au660 Wafers(bump) Low hardness, high-speed, neutral non-cyanide
MICROFAB Au3151 High hardness, high-speed, neutral non-cyanide

Gold alloy electroplating

AUTRONEX series

Excellent electrical properties, abrasion resistance, corrosion resistance, and solderability. This series is suitable for connectors and other electronic components.

NEUTRONEX series

Non-cyanide gold-copper alloy process. High hardness deposits and excellent thickness uniformity.

GALVANOMEISTER GT series

Electrolytic gold-tin alloy process. This series allows easy adjustment of alloy ratios, making it possible to adjust them according to their melting temperatures.

GALVANOMEISTER GS series

Electrolytic gold-silver alloy process. This series has both the corrosion resistance of gold and reflectivity of silver, making them ideal for LED components.

Process name Application Features
Au-Co AUTRONEX GVC Connectors, PWB Acidity cyanide
AUTRONEX ICC-7 Ni barrier property, Acidity cyanide
Au-Ni AUTRONEX GVN Connectors, PWB Acidity cyanide
AUTRONEX ICN100 Ni barrier property, Acidity cyanide
Au-Cu NEUTRONEX 240 Connectors, PWB Neutral non-cyanide
Au-Sn20% GALVANOMEISTER GT1000 Alternative to coalescent Acidity cyanide
Au-Ag50% GALVANOMEISTER GS3000 Lead frames Alkali cyanide

Gold strike plating

AUROBOND series

With "AUROBOND TCL" (Chlorine) and "XPH20" (Chlorine free), stainless steel can be plated directly in a strongly acid strike bath.

NEUTRONEX Strike

Non-cyanide type strike bath.

Process name Application Features
AUROBOND TN General use Acidity cyanide
AUROBOND TCL SUS materials Strongly Acidity cyanide
AUROBOND XPH20 Chlorine-free, Strong acidity cyanide
NEUTRONEX Strike Wafer Neutral non-cyanide

Electroless gold plating

LECTROLESS Au series

Excellent adhesion and solder wettability on electroless Ni plating.
"IG100" develops uniform film thickness on Pd film.

CERAGOLD series

Self-reduction type thick Pb-free electroless gold plating process.

PRECIOUSFAB IG series

Non-cyanide electroless gold plating process applied to electrolytic and electroless Ni plating.

Process name Application Features
LECTROLESS Au1100S Bonding pad areas Immersion thin plating, cyanide
LECTROLESS FX-5 Immersion thick plating, cyanide
LECTROLESS IG100 Uniform immersion thick Pd plating, cyanide
LECTROLESS IGS2020 Uniform immersion thick Pd plating, non-cyanide
CERAGOLD 6060 Ceramic components Reduction thick plating, Pb-free, cyanide
PRECIOUSFAB IG7901 Wafers (bonding pad areas) Immersion thin plating, non-cyanide

Silver plating

SILVREX series

"JS-5" exhibits semibright to bright surface and enables plating with a high current density. "5" exhibits very bright surface, making this series ideal for LED components.

PRECIOUSFAB Ag series

Non-cyanide process developed for wafer use

Process name Application Features
SILVREX JS-5 Lead frames High-speed, cyanide
SILVREX 5 General use Brightening agent, cyanide
PRECIOUSFAB Ag4730 Wafers Non-cyanide

Platinum group

PALLADEX series

"LF-5" exhibits excellent corrosion resistance at high temperatures for Pd-PPF. The "AD series" is a work environment friendly process with less ammonia odor.

PLATANEX series/PRECIOUSFAB Pt series

Platinum plating process that enables thick plating with low stress and crackless.

RHODEX

Rhodium plating process that enables thick plating for industrial use.

Process name Application Features
Pd DECOREX Decorative articles White bright surface
PALLADEX LF-5 Lead frames
(Pd-PPF)
Thin-film high heat resistance
PALLADEX ADG820 Thin-film high heat resistance, Neutral
PALLADEX 82GV-E Connectors Pd-Ni 20% alloy
PALLADEX PC200 Pd-Co 20% alloy
MICROFAB Pd700 Wafers (bump) Neutral, thick plating
Pt PLATANEX 3LS Electronic components Acidity
PRECIOUSFAB Pt3000 Wafers Mild acidity
PLATINART 100 Decorative articles Thick plating
Rh RHODEX Electronic components High hardness
SUPER WHITE Decorative articles White surface
SUPER RHODIUM No. 1 Bright surface
Ru RUTHENEX Electronic components High hardness
Ir IRIDEX 300