Joining Technology

High-purity Materials for Evaporation, Bonding, and Sealing

We offer a wide variety of high quality products.

Various bonding and sealing materials for precision parts, including evaporation materials for semiconductor devices are available.

Features

  • Gold and gold alloys are available in wire, ribbon, pellet, block, and ball forms.
  • Reduced trapped air and oxidized additives
Typical Compositions and Shapes
Item Shape
Wire Ribbon Pellet Block Ball
Au (99.99% , 99.999% )
AuSb1.0
AuZn5.0
AuSi3.15
AuBe1.0
AuGe12.5
AuSn20

Compositions other than listed those above are available
Composition range in between AuSn18 to AuSn30 is capable

Application

Die bonding, wafer evaporation, bonding, sealing, etc.

Gold alloy series

Gold alloy series

Au-Ge ball

Au-Ge ball