Electrical Relay and Connection Technology

Bonding Wires

We are the world's largest provider of bonding wires, delivering optimum quality wires suitable for ICs and LSIs.

Bonding wires are used for a wide range of products, such as ICs, LSIs and transistors. We bring you sound products at the cutting-edge of semiconductor technology.

Short Loop Application

Short Loop Application

Long Loop Application

Long Loop Application

Multi-wire bonding

Multi-wire bonding

Gold Bonding Wire

Features

Au wire

Au wire

  • Available with various types of package design such as DIP, SIP, QFP, BGA and FBGA.
  • Available with the latest type of package such as stacked package and super thin package.
  • Use of higher tensile strength wires enables cost reductions with finer diameters.
  • Use of higher tensile strength wires enables use with fine pitch package.

Gold Bonding Wire Characteristics and Applications by Type

(Wire Size = 20 µm)
Type Product Specifications Application Feature
Breaking load
(mN)
Elongation
(%)
Au wire
(Purity of 99.99%)
Y 34-65 2.0-5.0 LED,TO,DIP,SIP Excellent performance in thermal stress environment
GSA 43-92 1.0-7.0 QFN,QFP,DIP,SIP,CSP Stable 2nd-bonding
Fine pitch bonding
GSB 51-99 1.0-7.0 QFN,QFP,BGA,DIP,SIP,CSP
FA 64-113 2.0-6.0 DIP,SIP,QFP,BGA,CSP Excellent bonding
GMG 62-111 1.0-7.0 DIP,SIP,QFP,BGA,CSP Good for fine pitch small pads
Good for long & short loops
GFC 49-97 1.0-7.0 High strength with less wire sweep
Good for fine pitch small pads
GFD 58-106 1.0-7.0
GMH-2 66-114 1.0-7.0 High strength with less wire sweep
Good for fine pitch pads
GLF 55-103 2.0-7.0 Less neck damage, good for fine pitch pads
Good for super low loops

Gold Alloy Bonding Wire

Features

  • Smaller squashed ball area
  • Superior bonding reliability
  • Can be used on conventional ball bonders
  • No wire bonder stop and no drop of pull strength during continuous bonding

Aged at 200°C for 1000 hours

GPG, GPG-2

GPG,GPG-2

Au wire (Purity of 99.99%)

Au wire (Purity of 99.99%)

GPG · GPG-2 Types

Features

  • High bonding reliability when combined with halogen resin
  • Stable bonded ball shape. Good ball roundness (GPG-2)

GPH Types

Features

  • High bonding reliability when combined with non-halogen resin

Gold Alloy Bonding Wire Characteristics and Applications by Type

(Wire Size = 20 µm)
Type Product Specifications Application Feature
Breaking load
(mN)
Elongation
(%)
Au alloy wire
(Purity of 99%)
GPG 66-99 1.0-7.0 DIP,SIP,QFP,BGA,CSP High reliability with 99.99% Au wires, good for fine pitch pads
Applicable to halogen resin
GPG-2 61-109 1.0-7.0
GPH 55-101 1.0-7.0 High reliability with 99.99% Au wires, good for fine pitch pads
Applicable to non-halogen resin

Copper Bonding Wire

Features

  • Enables a reduction in costs with a lower material cost than gold bonding wires

Size

  • φ20μm~φ70μm

Comparison of Properties of Gold and Copper

Copper has excellent properties as a conductor.
Physical Properties Au Cu
Resistivity:[µΩ · cm] 2.3 1.7
Thermal conductivity:[W/m · K] 320 398
Young's modulus:[GPa] 80 135

Cross-sectional Structure of the First Bonding Portion after a High Temperature Storage Test

  • Voids due to Al intermetallic diffusion are unlikely to form.

*HTS conditions: Temp. 473K , Molded HF resin

Copper Bonding Wire Characteristics and Applications by Type

(Wire Size = 20 µm)
Type Product Specifications Application Feature
Breaking load
(mN)
Elongation
(%)
Coated Cu CLR-1A 39-87 5.0-15.0 QFN,QFP,BGA,CSP High-performance copper wire
Wide bonding window
Cu Alloy CA-1 41-93 7.0-17.0 QFN,QFP,BGA,CSP High reliability, good for high 2nd-bonding
Bare Cu
(Purity of 99.99%)
CFB-1 43-94 7.0-17.0 QFN,QFP,BGA,DIP,SIP,CSP High 2nd-bonding
Stable continuous bondability
TCA-1 42-90 5.0-15.0 Good for fine pitch pads
Stable ball formation
TCB-1 27-76 5.0-15.0 Soft and stable ball formation

Aluminum Bonding Wire for Power Devices

TANW Types

Features

  • Excellent corrosion resistance
  • Excellent bondability
  • Hard, Soft-1, and Soft-2 are available according to applications

Size

  • Φ 100 to 500 µm
Aluminum wire

Aluminum wire

PCT:at 120℃, RH100%, 2atm

Aluminum Bonding Ribbon

TABR Types

Features

  • Excellent corrosion resistance
    (equivalent to TANW wire)
  • Available with multi-sizes

Size

  • Width 0.5 to 2.0 mm、
    Thickness 0.05 to 0.25 mm
Aluminum ribbon

*The winding length differs depending on the ribbon size.

Aluminum-Silicon Bonding Wire

TABN Types

Features

  • Uniform Si distribution
  • Stable mechanical properties
  • Stable quality wire without any curl, dirt and surface flaws
  • Excellent bondability
  • Excellent corrosion resistance

Size

  • Φ 18 to 80 µm
Aluminum-silicon wire

Aluminum-silicon wire

Silver Alloy Bonding Wire

SEA, SEB, SEC Types

Features

  • Lower material costs than gold wire and higher bondability than copper wire
  • High reflectivity in low wavelength region
Silver alloy wire

Silver alloy wire

Features of gold wire,
copper wire and silver wire

Features of gold wire, copper wire and silver wire

Reflectivity

Specific resistance

Specific resistance

Reflectivity