- Enables direct bonding of ceramics without metalized layers
- Provides bonding strength equivalent to or higher than conventional methods
|TKC-651||AgCuSnTi alloy||Approx. 770°C||Sheet||Width:
110 mm or less
0.05 mm or more
0.2 mm or more
Active Metal Brazing Method
Adding active metals such as titanium to conventional brazing filler metals provides improved wettability and bonding strength. With active brazing filler metals, bonding can be performed with a single heating, enabling the work to be done with less man-hours and shorter lead times.
Bonding Mechanism of Active BFMs
Bonding of ceramic jigs, engine components, electronic components for ceramic heat sinks, ceramic circuit boards, etc.
Enlarged photograph of the brazing layer